Artificial intelligence (AI) is changing the world of IT infrastructure. The demand for computing power and capacity is growing so rapidly that the requirements for scaling, energy efficiency, cooling and power distribution in data centers will also reach a completely new level. At the OCP Regional Summit in Lisbon, global solution provider Rittal will be providing a preview of a new module platform for single-phase direct liquid cooling specifically for the OCP Open Rack V3. At full capacity, it enables over 1 megawatt of cooling capacity. Modular solutions for power, cooling and monitoring directly in the rack ensure rapid scalability and economical operation.
AI is only just beginning. 2024 will be the year of roll-outs. The IT infrastructure needs to grow as quickly as possible, and hyperscalers are leading the way. "To make this growth technically, economically and organizationally possible, standardization and scalability through modularization and global availability are needed," says Lars Platzhoff, Head of the Cooling Solutions business unit at Rittal: "The OCP standards and Rittal's liquid cooling systems for IT racks provide an excellent basis for this."
Getting the heat out faster
The power density of AI applications, such as training and running large language models (LLMs) in future data centers, will require a technological breakthrough, especially when it comes to cooling. Today's conventional air cooling will increasingly reach its physical and economic limits. The new, ultra-fast graphics processing units (GPUs) generate so much heat that manufacturers are designing them for powerful direct liquid cooling. Solution provider Rittal has developed a new modular cooling platform for this purpose and will be presenting a preview of the solution for the OCP Open Rack V3 at the OCP Regional Summit in Lisbon.
Modular platform for single-phase direct liquid cooling
Rittal is using coolant distribution units for single-phase direct liquid cooling with water that have been specifically designed for use in the Open Rack V3. "The aim is to offer our customers a scalable complete solution from a single source with high global availability and easy serviceability," explains Platzhoff.
How does this work? With modularization and the design advantages of OCP: Following the example of the power supply, the server in the rack is simply connected to the central inlets and outlets of the water circuit via standardized connections. "The combination options of the platform modules are designed for high flexibility," says Platzhoff. Liquid-to-liquid solutions, where the heated water is conducted to the outside, provide the highest cooling capacity. They are also ideal for reducing the CO2 footprint through heat recovery. As an in-row solution, they cool over 1 megawatt, up to 100 kW in a single rack. Alternatively, liquid-to-air variants are available, which dissipate heat into the data center air at the rear rack door or via a side cooler - a closed system without a water connection.
Everything in the rack
"Rittal is the main rack supplier for several hyperscalers. We developed the cooling solution in close cooperation with these partners," says Platzhoff: "Power, cooling and monitoring are integrated directly into the standardized rack as fundamental elements of the IT infrastructure. We are convinced that this concept will soon become the standard for our global IT customers due to the high demand for ever higher cooling capacities and Rittal's ability to scale quickly. In addition to hyperscalers, it will also be of interest to an increasing number of colocators. With the Open Rack, OCP is at the forefront of this idea. As the primary designer of the ORV2 and ORV3 racks, Rittal will continue to participate in the Open Compute Project.